TIE-M Plus 2026
Engineering competition entry covering design, analysis and technical presentation.
2nd Place
Engineering. Simulation. Electronics. Reliability.
Multidisciplinary engineering team working on mechanical design, simulation, structural analysis and reliability.
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Engineering disciplines we work in. Skills are demonstrated through projects, not percentages.
Component and assembly design driven by function, loads and manufacturability.
Discretised numerical models used to predict stress, strain and deformation.
Load paths, stiffness and failure modes assessed analytically and numerically.
Lifetime and failure-mechanism assessment instead of single-point verification.
Coupled thermal and mechanical response under cycling and transient loads.
Parametric 3D models and drawings prepared to engineering documentation standards.
Physical hardware built to turn assumptions into measurable behaviour.
Measurements used to confirm — or correct — what the models predicted.
Literature-based investigation of methods, standards and material models.
Engineering work in progress and completed. Detailed case studies stay editable as new results arrive.
Engineering competition entry covering design, analysis and technical presentation.
2nd Place
Thermal-mechanical modelling of a solder interconnect to assess fatigue life and assembly reliability.
Finalist
Solder Soldiers combines mechanical, structural, simulation, electronics and reliability engineering.
Mechanical & Simulation Engineer
Thermal-mechanical simulation, structural analysis and reliability
Only confirmed competitions, results and milestones. Open outcomes are marked as such.
2nd Place
First competition entry — design, analysis and technical presentation.
Finalist
Interconnect reliability study — thermal-mechanical simulation and solder fatigue assessment, delivered by a three-member team.
Participation status to be confirmed. [Editable placeholder.]