Timeline

Achievements

Competitions, awards, finalist selections, conference presentations and technical milestones — confirmed entries only.

  1. 2026Award

    TIE-M Plus

    2nd Place

    First competition entry — design, analysis and technical presentation.

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  2. 2026Competition

    IEEE ESTC Student Competition

    Finalist

    Interconnect reliability study — thermal-mechanical simulation and solder fatigue assessment, delivered by a three-member team.

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  3. 2026ConferenceSingapore

    EPTC

    Participation status to be confirmed. [Editable placeholder.]

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Editable timeline — add new entries in src/data/achievements.ts. Outcomes that are not yet confirmed stay marked as pending rather than assumed.